Discover How to Tackle Cross-Fabric Thermal and Stress Challenges

Are thermal and stress challenges impacting your 3D-IC designs? As integration increases and designs grow more complex, the need for robust, reliable solutions has never been greater. This white paper is your guide to understanding and overcoming these challenges.
Learn how the Celsius Thermal Solver:

• Delivers accurate thermal, mechanical and stress analysis using advanced FEA and CFD
• Integrates seamlessly with Cadence’s design tools for streamlined workflows
• Accelerates simulations 10X with parallel and distributed processing

 Enabling you to:

• Optimize power, performance, and area (PPA) metrics
• Perform co-analysis of chips, interposers, packages, and PCBs
• Predict and mitigate thermal and stress-related issues early in the design processl
• Gain actionable insights to overcome power density, thermal resistance, and material stress challenges.

 Download the white paper now and start improving your 3D-IC designs today!